Technologies

Production Capabilities

Prototype, Quick-Turn & Small to Medium Production
Single Sided, Double Sided, Multi-layer up to 12 Layers

Materials

FR-1, FR-4, CEM-1, CEM-3, XPC

Panel Size

Max. 610mm x 510mm

Board Thickness

0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm

Copper Thickness

18㎛, 35㎛, 70㎛, 105㎛ (finished) SMOBC

Smallest Hole Size

Min. : 0.15mm (finished)

Trace Width / Space

Min. 0.127mm (5 mil)

Solder Mask & Silk Screen

Solder Mask : LPI in Green, Red, Blue, Yellow Black available colors
Silk Screen : White, Yellow, Black available colors

CU PTH

Min. : 17 - 20㎛, Ave. 25㎛
Max.: More than 35㎛

Immersion NiAu / Chemical NiAu / Galvanic NiAu

Nor. : Au 0.08㎛ over Ni 2.54㎛/Min.
Max. : Au 1.0㎛ over Ni 4.0 - 5.0㎛

Gold Connectors

Nor. : Au 0.30㎛ over Ni 2.54㎛/Min.
Max. : Au 1.30㎛ over Ni 4.0 - 5.0㎛

Tab-Route (Breakaway Holes)

Nor. : 2.0mm

V-Scoring

Nor. : 0.30 - 0.50mm

Electrical Test

Flying Probe, Fixture (Universal, Dedicate)
One/Two side SMT (100mil/pitch)

Tolerance

Registration (Hole to Hole) : 0.05mm (PTH), 0.15mm (NPTH)
Board Thickness : Standard 10%, Special 5%
Trace Width Reduction : Standard 20%, Special 10%
Hole Size : PTH ±0.1mm, NPTH ±0.05mm
Annular Ring : 0.3mm/Min.
Bow / Twist : 1.0%/Max.